Plasma display panel having a discharge stabilizer powder and method of manufacturing the same

ABSTRACT

A technique for achieving both discharge voltage reduction and discharge stabilization in a PDP and the like is provided. This PDP manufacturing method includes, for a structure of a front plate structure ( 11 ) to be exposed to a discharge space ( 30 ) to be filled with a discharge gas, a step of forming a first layer ( 4 ) having an effect of discharge protective layer on a dielectric layer ( 3 ), a step of forming a second layer ( 5 ) for protecting the first layer on the first layer, and a step of forming a third layer ( 6 ) of a powder for discharge stabilization to be exposed to the discharge space ( 30 ), the steps being performed in vacuum manufacturing process. And, the structure is made such that a surface of the first layer is exposed to the discharge space ( 30 ) by a step of removing the second layer by an aging discharge in the discharge space ( 30 ).

TECHNICAL FIELD

The present invention relates to a display device such as a plasmadisplay panel (PDP), and more particularly, it relates to a powdermaterial (priming particle (electron) emitting powder) etc. forstabilizing discharge of the PDP.

BACKGROUND ART

For an alternate-current type PDP and a display device of the PDP,stabilization of discharge (discharges in a discharge space and displaycell) in the PDP is an important technique. To stabilize the discharge,a PDP structure and a material by which discharge is fired at a furtherlower voltage and plenty of priming particles (electrons) are suppliedto the discharge space are necessary.

As the PDP structure and material for the purpose, a film (layer) ofmagnesium oxide (MgO) has been conventionally used to a surface being incontact with (exposed) to discharge (discharge space).

For example, there is a structure in which a protective layer (dischargeprotective layer) of MgO is provided on a dielectric layer of a frontplate structure in a PDP. Also, there is a structure in which apriming-particle-emitting powder (layer) of MgO crystal powder or thelike is further provided on the protective layer.

While the above-mentioned MgO film is a material sufficiently workingand effective, a material which outperforms MgO (effects of a dischargevoltage reduction etc. by MgO) is needed to further improve displaycharacteristics of PDPs.

As a material for the further improvement, strontium oxide (SrO),calcium oxide (CaO) and the like have been already found out asmaterials which lower the discharge voltage. However, films(low-discharge-voltage films) formed of these materials are unstable inthe air, and thus they cannot be handled well as they are in themanufacturing process.

To handle the films of the above-mentioned materials such as SrO and CaOwell, as described in Japanese Patent No. 3073451 (Patent Document 1),there has been suggested a method in which a surface of the film of anyof these materials after deposition is covered with an inactive (inert)film (air barrier layer (temporary protective film)) so that reaction inthe air (reaction with moisture, carbon-rich gas etc.) is suppressed(prevented), and the inactive film is removed after panel assembly.

In addition, the following is a supplementation to the above dischargestabilization (discharge delay improvement). Along with achievement ofhigher definition of the PDP, to shorten an address period, it iseffective to reduce a width of an applied voltage pulse. However, thereis a variation in the time (discharge delay) from application of avoltage (e.g., address voltage) to generation of a discharge (e.g.,address discharge). Thus, when the width of the applied voltage pulse issmall, there is a possibility that discharge may not be generated eventhe pulse is applied. In that case, as display cell are not turned ONproperly, an image quality degradation will be posed. As a means forimproving the above-mentioned discharge delay, there is a technique ofproviding MgO crystal (layer) as a priming-particle-emitting powder(layer) to be exposed to a discharge space in a front plate structure.Such a technique is described in, for example, Japanese PatentApplication Laid-Open Publication No. 2006-59786 (Patent Document 2).

Patent Document 1: Japanese Patent No. 3073451

Patent Document 2: Japanese Patent Application Laid-Open Publication No.2006-59786

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

The low-voltage discharge film described above has a problem that it isdifficult to generate a stable discharge as supplement of primingparticles (electrons) is lacking. In other words, for example, astructure, in which the above-mentioned discharge protective layer ofSrO or CaO is provided, has a discharge voltage reduction effect, buthas a problem that not much discharge stabilizing (discharge delayimproving) effect is obtained than, for example, the structure in whicha priming-particle-emitting powder (layer) is provided on a dischargeprotective layer of MgO.

The present invention has been made in view of the above problem, and amain preferred aim of the present invention is to provide a techniquecapable of achieving both a reduction or maintaining of the dischargevoltage and discharge stabilization (discharge delay improvement) sothat the display characteristics can be further improved than everbefore.

Means for Solving the Problems

The typical ones of the inventions disclosed in the present applicationwill be briefly described as follows. To achieve the above-mentionedpreferred aim, a typical embodiment is, as the above-describedconfiguration for achieving both discharge voltage reduction anddischarge stabilization, a technique of a display device such as a PDP,in which a discharge protective layer (called a first layer todiscriminate), a discharge stabilizer powder (called a third layer todiscriminate), and so forth are provided to a plate structure to whichelectrode groups and dielectric layers and so forth are formed; and theembodiment has the following configuration.

The present embodiment is a configuration having a structure in which anair barrier layer (second layer) is formed to a surface of a low-voltagedischarge protective film (discharge protective layer (first layer))combined with a structure in which a discharge stabilizer powder (thirdlayer) exposed to a discharge space is provided. In the presentembodiment, in a PDP manufacturing process (in a vacuum environment notexposed to the air), the above-mentioned air barrier layer (called asecond layer to discriminate) is formed on the discharge protectivelayer (first layer) on the dielectric layer in the plate structure, andthe discharge stabilizer powder (third layer) is further formed on thesecond layer. A crystal-like material (material having a highcrystallinity) having a high ability of supplying priming particles isused as the powder (third layer).

And, in a PDP manufacturing process, after panel assembly, exhaust,discharge-gas filling etc., the second layer (most part thereof) isremoved. In this manner, the surfaces of the first layer and the thirdlayer (powder) are exposed to the discharge space (discharge gas).Consequently, a state of a panel product is obtained.

In the PDP of the present embodiment, for example, SrO, CaO or a mixedsubstance of SrO and CaO is used as the first layer. As the secondlayer, MgO is used. As the third layer (powder), MgO crystal powder isused.

According to the above-described configuration (combination of threekinds of layers), basically, a discharge voltage reduction by the firstlayer, a suppression of reaction with air of the first layer, anddischarge stabilization (usage of priming-particle supply) are achieved.

In addition, a PDP of another embodiment has a configuration in which anair barrier layer having the same function or formed of the samematerial as that of the second layer is further formed as a surface filmto each surface of the powder particles with respect to the third layer(discharge stabilizer powder). Consequently, suppression of reactionwith air of the third layer (powder) is also achieved.

A method of manufacturing a plasma display panel according to theembodiment includes, for a structure of a plate structure (front platestructure) on a side to be exposed to a discharge space (dischargesurface) to which a discharge gas is filled, the steps of: forming afirst layer having a discharge protection function on a dielectric layerwithout exposing to the air; forming a second layer for protecting thefirst layer from exposure to the air on the first layer; forming a thirdlayer of a powder for discharge stabilization on the second layer suchthat the third layer is exposed to the discharge space, in vacuummanufacturing process. And, the present manufacturing method includes astep of forming a structure in which at least a part of the second layeris removed by an aging discharge in the discharge space and at least apart of a surface of the first layer is thus exposed to the dischargespace from the second layer after the removal.

Effects of the Invention

The effects obtained by typical aspects of the present invention will bebriefly described below. According to a typical embodiment, in a PDP andthe like, by the configuration of the combination including the firstlayer and the third layer (and second layer), both effects of reductionor maintaining of the discharge voltage and discharge stabilization(discharge delay improvement) are achieved, thereby improving displaycharacteristics more than ever before.

BRIEF DESCRIPTIONS OF THE DRAWINGS

FIG. 1 is a diagram illustrating a basic structure example by anexploded perspective view enlarging a main part (pixel) of a PDPaccording to an embodiment of the present invention;

FIG. 2 is a diagram illustrating a summary of a basic manufacturing flowof a method of manufacturing the PDP according to the embodiment of thepresent invention;

FIG. 3 is a diagram schematically illustrating, in a perspective manner,a cross-section (y-z) and a configuration of a surface exposed to adischarge space of a discharge cell part in a front plate structureincluding a first layer, second layer, and third layer in vacuummanufacturing process of a PDP according to a first embodiment of thepresent invention;

FIG. 4 is a diagram schematically illustrating, in a perspective way, across-section (y-z) and a configuration of the surface exposed to thedischarge space of the discharge cell part in the front plate structurein a state (as panel product) of having the second layer (most partthereof) removed of the PDP according to the first embodiment of thepresent invention;

FIGS. 5A-5D are diagrams schematically illustrating cross-sectionconfigurations of a discharge stabilizer powder forming the third layerin the case of having a surface film (air barrier layer), FIG. 5Aillustrating a state of an original powder, FIG. 5B illustrating a stateof having the surface film formed to the powder, FIG. 5C illustrating astate of having the powder attached onto the second layer, and FIG. 5Dillustrating a state of having the surface film of the powder beingremoved, respectively.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. Note that componentshaving the same function are denoted by the same reference symbolsthroughout the drawings for describing the embodiment, and therepetitive description thereof will be omitted.

<Outline>

An outline of a PDP and a method of manufacturing the PDP according to apresent embodiment is as follows (note that the reference numeralscorrespond to those in the embodiments described later). Uponmanufacturing the present PDP 10, in a front plate structure 11, a firstlayer (discharge protective layer 4), a second layer (air barrier layer5), and a third layer (discharge stabilizer powder 6, in other words,priming-particle-emitting powder (layer)) are stacked in sequence onto adielectric layer 3 covering a group of display electrodes 2 on a glasssubstrate 1. A panel (PDP 10) is assembled by combining the front platestructure 11 and a back plate structure 12, and discharge spaces 30 areformed by vacuum exhaust and discharge-gas filing to an internal spaceof the panel, and thus once a panel having a structure of having thesecond layer is fabricated. Thereafter, by a step of an aging discharge(initial discharge) in the discharge spaces 30 of the panel, the secondlayer (most part thereof) is removed, so that a structure in which asurface of the first layer and the powder of the third layer are exposedto the discharge spaces 30 is obtained. In this manner, a desired PDP 10product is finished.

A material of the first layer (discharge protective layer 4) containsone or more kinds from BeO, MgO, CaO (calcium oxide), SrO (strontiumoxide), and BaO which are oxides of alkaline-earth metals (including Beand Mg), alternatively, one or more kinds from Li₂O, Na₂O, K₂O, Rb₂O,and Cs₂O which are oxides of alkali metals.

A material of the second layer (air barrier layer 5) can be used in thesame way as the material described in Patent Document 1. That is, thematerial of the second layer contains one or more kinds from SiN, SiO₂,Al₂O₃, MgO, TiO₂, MgF₂, CaF₂, etc.

A material of the third layer (discharge stabilizer powder 6) contains acrystal powder (powder particles) of one or more kinds from BeO, MgO,CaO, SrO, and BaO which are alkaline-earth metals (including Be and Mg),alternatively, one or more kinds from Li₂O, Na₂O, K₂O, Rb₂O, and Cs₂Owhich are oxides of alkali metals.

In the present embodiment, as the materials of the respective layers,the followings are particularly used. As the first layer, as a materialhaving a higher discharge voltage reducing effect than that of MgO, amixture of SrO and CaO is used and deposited. As the second layer onthat, a MgO layer is deposited. As the third layer (powder 6) on that, asingle-crystal MgO powder is attached.

As a method of forming the first layer, vapor deposition or the like canbe used. As a method of forming the second layer, sequential vapordeposition or the like can be used. As a method of forming the thirdlayer (powder 6), for example, a method of spreading (spraying) orapplying a material containing the powder 6 onto the second layer or thelike can be used.

According to the present configuration, a discharge voltage (a voltageapplied for causing a discharge to occur in the discharge space 30(display cell)) is reduced to about −30 V as compared with aconventional configuration, and also, discharge delay is also improved.

<Basic PDP Structure>

An example of a basic structure of the PDP (panel) 10 of the presentembodiment is illustrated in FIG. 1. A part of a set of display cells(unit area 90) of respective colors corresponding to pixels isillustrated. Note that, for description, there are an x-direction(horizontal direction), a y-direction (vertical direction), and az-direction (perpendicular direction to the panel surface).

The present PDP 10 is formed by combining the front plate structure 11and the back plate structure 12, and the discharge spaces 30 (in FIG. 1,areas of grooves between barrier ribs 24 between the dischargeprotective layer 4 and a conductive layer 23) are formed by filling adischarge gas into the internal space between the front plate structure11 and the back plate structure 12.

In the front plate structure 11, a group of display electrodes 2 (2X,2Y) arranged repeatedly in the y-direction and extending in thex-direction on the glass substrate 1. The display electrodes 2 include asustain electrode 2X for sustain operation and a scan electrode 2Y forsustain operation and scanning operation (used in both operations). Thedisplay electrodes configure a display line by a pair of the adjacentsustain electrode 2X and scan electrode 2Y. The electrode arrayconfiguration can be a normal configuration (a configuration in whichthe pair of display electrodes 2 is provided to be a non-discharge area(reverse slit)) or a so-called ALIS configuration (a configuration inwhich the display lines are configured by all the adjacent pairs ofdisplay electrodes 2).

The group of display electrodes 2 on the glass substrate 1 is coveredwith the dielectric layer 3. On the dielectric layer 3, the dischargeprotective layer 4 is further formed. The dielectric layer 3 and thedischarge protective layer 4 are formed over the entire surfacecorresponding to a display area (screen) of the PDP 10.

In the back plate structure 12, a group of address electrodes 22 isarranged in the y-direction crossing the display electrodes 2 on a glasssubstrate 21. A display cell is formed corresponding to a crossing partof the sustain electrode 2X, scan electrode 2Y, and address electrode22. The group of address electrodes 22 is covered with the dielectriclayer 23. On the dielectric layer 23, the barrier ribs 24 are formed instripe extending in, for example, the y-direction at positions betweenthe address electrodes 22. Note that the barrier ribs 24 section thedischarge spaces 30 corresponding to the unit areas 90 (display cells).Above the address electrodes 22 and in the areas sectioned by thebarrier ribs 24, a phosphor 25 of each color of R (red), G (green), andB (blue) is formed in sequence in a different color per display column.

Upon driving the PDP 10, in an address period, a voltage is appliedacross the address electrode 22 and the scan electrode 2Y to generate adischarge (address discharge) in selected display cells. And, in asustain period, a voltage is applied across the pair of displayelectrodes 2 (2X, 2Y) to generate a discharge (sustain discharge) inselected display cells. By these operations, emission (turn-ON) atdesired display cells in a subfield is performed. In addition, byselecting a subfield to turn ON in a field, luminance of pixels (displaycells) is expressed.

<PDP Manufacturing Method>

An outline of a method of manufacturing the PDP 10 (common in first andsecond embodiments) according to the present embodiment is illustratedin FIG. 2 (S means a step). Steps of fabricating the front platestructure 11 (S1 to S6), a step of fabricating the back plate structure12, and steps from panel assembly to finish (S7 to S9) are included.

First, in the fabrication of the front plate structure 11, the glasssubstrate 1 is prepared in S1. Transparent materials such as glass canbe used for the glass substrate 1. In S2, the group of displayelectrodes 2 (2X, 2Y) is formed on the glass substrate 1 with usingscreen printing or photolithography plus etching, etc.

In S3, the dielectric layer 3 is formed to cover the group of displayelectrodes 2 on the glass substrate 1. The dielectric layer 3 formed by,for example, applying a low-melting-point glass paste by screen printingor the like, and baking.

In S4, the discharge protective layer 4 (first layer) is formed on thedielectric layer 3 by, for example, vapor deposition (alternatively,sputtering or application can be used).

In S5, the air barrier layer 5 (second layer) is formed on the dischargeprotective layer 4 (first layer) by, for example, sequential vapordeposition to the first layer.

In S6, the discharge stabilizer powder 6 (third layer) is formed on theair barrier layer 5 (second layer) by, for example, spreading of aslurry (powder-containing material) and drying.

Note that, in the case of a second embodiment described later, a surfacefilm (air barrier layer 62) of the discharge stabilizer powder 6 (thirdlayer) is formed in S21, and then the powder 6 is used in S6.

Note that S4 to S6 are manufacturing steps in vacuum (vacuum chamber)without exposure to the air.

Meanwhile, in S11, the back plate structure 12 is fabricated with usinga known technique in, for example, the following manner. The glasssubstrate 21, address electrode 22, dielectric layer 23 etc. can beformed in the same manner as the front side. The barrier ribs 24 areformed by forming a layer of a material such as a low-melting-pointglass paste and patterning it by sandblast or the like, and then bakingit. The phosphor 25 is formed by applying a phosphor paste to an areabetween the barrier ribs 24 to R, B, G, respectively, by screen printingor dispenser, and baking.

Next, in S7, the fabricated front plate structure 11 and back platestructure 12 are combined facing each other, so that the panel (PDP 10)is assembled. That is, the part between the front plate structure 11 andthe back plate structure 12 and the periphery are attached by anadhesive (low-melting-point glass or the like) and subjected to athermal processing to be sealed.

In S8, to the internal space of the panel, vacuum exhaust anddischarge-gas filling are performed through a tip-off tube connectedexternally, and the tip-off tube is sealed and cut, so that thedischarge spaces 30 are configured. In this manner, once the state of apanel having the structure including the second layer is obtained.

In S9, by an aging discharge (initial discharge) in the discharge spaces30 caused by a voltage application to the electrodes (2X, 2Y, 22) of thepanel, most part of the second layer (and, a surface film of the thirdlayer in the second embodiment) is removed. In this manner, a surface ofthe first layer and the powder 6 of the third layer are exposed to thedischarge spaces 30 and the panel product is completed.

(First Embodiment)

Based on the foregoing, the PDP 10 etc. (the discharge stabilizer powder6 etc.) and a method of manufacturing the PDP of a first embodimentwhich is a more detailed embodiment will be described with reference toFIGS. 1 to 3.

In FIG. 3, a cross-section (y-z) of the part of the discharge cells(unit areas 90) of the front plate structure 11 and a configuration ofthe surface (discharge surface) exposed to the discharge spaces 30 invacuum manufacturing process is schematically illustrated. Hereinafter,the structure of the front plate structure 11 will be descried in theorder of the manufacturing process (FIG. 2) (note that S21 isunnecessary in the first embodiment).

The display electrodes 2 (2X, 2Y) are formed on the glass substrate 1(S1, S2). The display electrodes 2 (2X, 2Y) are configured by atransparent electrode 2 a of ITO or the like having a large width andforming a discharge gap, and a bus electrode 2 b of, for example, athree-layer structure of Cr/Cu/Cr having a small width and lowering theelectrode resistance. Note that a normal configuration in employed inthe electrode array configuration in FIG. 3.

Then, the dielectric layer 3 is formed to cover the display electrodes 2on the glass substrate 1 (S3). As the dielectric layer 3, for example, alayer of a low-melting-point glass is formed to have a thickness of 20μm.

The first layer (discharge protective layer 4) is formed on thedielectric layer 3 (S4). As the first layer, a layer of a eutectic(mixed crystal) of SrO and CaO (expressed by (Sr, Ca)O) is deposited.This (Sr, Ca)O layer is formed to have a thickness of 1 μm by vacuumvapor deposition (performed in a vacuum chamber). Allocation of Sr (SrO)and Ca (CaO) is, for example, 50% each. The discharge protective layer 4has a function of protecting the dielectric layer 3 (sputter resistance)and secondary-electron emission, etc.

Subsequent to the formation of the first layer, the second layer (airbarrier layer 5) is formed on a surface of the first layer (S5). As thesecond layer, a MgO layer is formed to have a thickness of 0.1 μm byvapor deposition in the same way. The second layer (MgO layer) is formedof a material having a stable property in the air, and it is a layer fortemporally protecting (suppressing reaction with air) the first layer,that is, upon air exposure.

After taking out the substrate (front plate structure 11) from thevacuum chamber, the third layer (discharge stabilizer powder 6) isformed on a surface of the second layer (S6). The third layer (powder 6)is a priming-electron-emitting powder (layer), in other words. As adischarge stabilizing material for the third layer, particularly, singlecrystal MgO powder (particle) is used. Note that, the material to beused is not limited to single crystal (polycrystalline, aggregationsubstance, etc.).

With the powder 6 (MgO crystal), a discharge delay improving effect canbe obtained by the function of emitting (supplying) priming particles(electrons) to the discharge space 30. Note that details of thisfunction has not been particularly revealed, but it has been presumedthat priming particles (electrons) are emitted (supplied) to thedischarge space 30 from the powder 6 (MgO crystal) along discharge andreact with particles in the discharge space 30.

The powder 6 is attached by spreading onto a subject surface (secondlayer surface). For example, a slurry (discharge stabilizer powdercontaining material) made by mixing and dispersing the powder 6 (singlecrystal MgO powder) in a powdery state in a solvent (IPA etc.) isprepared. And, the slurry is arranged (attached) onto the subjectsurface in a sheet-like and film-like manner by spreading with apainting spray gun or the like. Then, the film portion (slurry) is driedby heating and so forth to remove the solvent component and the powder 6component is fixed onto the subject surface. Other than the slurryspreading method, a paste application method can be used. In the abovemanner, front plate structure 11 is formed.

Note that, in the third layer (powder 6), the powder 6 (crystal)(illustrated by a cube) is distributed sparsely and densely with respectto the subject surface (second layer surface). In the presentembodiment, the situation where the powder 6 is sparsely distributed isschematically illustrated. Note that even when the powder is distributedsparsely, it is called a layer (film).

Thereafter, the front plate structure 11 and the back plate structure 12are combined and their periphery is sealed, so that the panel isassembled (S7). Then, after vacuum exhaust, a heating degassing processis performed and filling of a discharge gas (e.g., Xe 10%, Ne 90%) at450 Torr pressure (S8) performed to the internal space of the panel.

Thereafter, most part of the second layer is removed by an agingdischarge (S9). In this step, an alternate voltage is applied to thepair of display electrodes 2 to generate a discharge in the dischargespace 30. By this discharge, the surface of the second layer (MgO layer)is sputter-etched (plasma-etched), thereby removing the MgO.Confirmation about whether MgO is removed or not can be determined bymonitoring the reduced amount of the discharge voltage.

By the above-described step of the aging discharge (S9), the front platestructure 11 becomes the state of FIG. 4 (at panel manufacture). In thesecond layer, a part of it, i.e., the part to which the powder 6 isattached (under and around the powder 6) remains without being removedby the sputter etching (there is no problem functionally). And, mostpart of the second layer other than that part is removed, therebyexposing the first layer surface. That is, both of the first layer andthe powder 6 of the third layer are exposed to the discharge space 30,thereby obtaining a designed functional layer.

The PDP 10 of the first embodiment fabricated in the above-describedmanner has a discharge voltage being −20 V lower (to be about −30 V) ascompared with the conventional panel having a discharge protective layerof MgO alone. Also, as the discharge delay time indicatingcharacteristics (effects) of the discharge stabilization becomes shorterthan or equal to 0.5μ seconds, a panel operating at a sufficiently highspeed is achieved. Note that a discharge delay time indicatingcharacteristics (effects) of the discharge stabilization posed by theexistence of the third layer can be measured and diagnosed by, forexample, applying a voltage waveform for testing as a known technique.

(Second Embodiment)

With reference to FIG. 5, a PDP 10 and a method of manufacturing the PDPaccording to a second embodiment will be described. A configuration ofparts of the second embodiment different from the first embodiment is asfollows. While the case of using single crystal MgO as the dischargestabilizer powder 6 (the third layer) has been described in the firstembodiment, other than that, single crystal SrO and single crystal CaOalso function as the material (note that it is not limited to usingsingle crystals). Powder of these materials are prone to react withmoisture (H₂O) and carbon dioxide (CO₂) same as the case of using as thematerial of the discharge protective layer 4 (the first layer) (thefirst embodiment), and due to the reaction, a film (reacted layer) ofhydroxide and carbonation product is formed on the surface of crystal ofthe powder.

In the second embodiment, also regarding the crystal (single crystalSrO, single crystal CaO) of the above-described discharge stabilizerpowder 6 forming the third layer, the structure is such that the crystalsurface is covered with a material having a stable property in the air,that is, a material similar to the second layer. In this manner, thereaction between the powder 6 of the third layer and the air issuppressed, thereby preventing formation of the reacted layer.

A material of a surface film (air barrier layer) 62 of the powder 6 canbe selected from magnesium (Mg), silicon (Si), aluminum (Al), titanium(Ti), yttrium (Y), zirconium (Zr), tantalum (Ta), zinc (Zn), cobalt(Co), manganese (Mn), and lanthanum (La).

In the cross-sectional structures of the discharge stabilizer powder 6illustrated in FIGS. 5A-5D, a powder 61 portion to be a core and thesurface film (air barrier layer) 62 portion of the powder 61 portion areincluded. FIG. 5A is the original (unprocessed) discharge stabilizerpowder 6, and for example, it is above-mentioned single crystal SrO orsingle crystal CaO. FIG. 5B is the discharge stabilizer powder 6 afterbeing processed, and it is a double-layer structure having the surfacefilm (air barrier layer) 62 formed around the powder 61 to be a core. Asthe surface film (air barrier film) 62, specifically, MgO or SiO₂ isused. As a method of forming the surface film 62, for example, thesurface film 62 is grown to be attached on the powder 6 (61) by CVD(chemical vapor deposition). Note that the method of forming the surfacefilm 62 and the structure of the powder 6 can be seen as a configurationin which the surface film 62 is stacked on the surface of the powder 6(61) or a configuration in which the surface portion of the powder 6(61) is changed to be the surface film 62.

In FIG. 5C, the powder 6 with the surface film 62 fabricated in theabove manner is attached onto the second layer so that the third layeris formed. And, as illustrated in FIG. 5D, the air barrier layer, i.e.,the second layer (air barrier layer 5) and the surface film 62 of thepowder 6 of the third layer can be removed by sputter etching by theaging discharge (S9). According to the removal, in the panel productstate, the surface of the powder 6 (61) of the third layer can beexposed as a clean crystal face.

According to the PDP 10 of the second embodiment fabricated in theabove-described manner, in addition to the effects same as those of thefirst embodiment, an effect of suppressing reaction with the air can bealso obtained by the discharge stabilizer powder 6(priming-particle-emitting powder (layer)).

In the foregoing, the invention made by the inventors of the presentinvention has been concretely described based on the embodiments.However, it is needless to say that the present invention is not limitedto the foregoing embodiments and various modifications and alterationscan be made within the scope of the present invention.

INDUSTRIAL APPLICABILITY

The present invention is applicable to display devices such as a PDP.

1. A plasma display panel, comprising, in a structure of a platestructure on a side exposed to a discharge space filled with dischargegas: a first layer formed on a dielectric layer and having a dischargeprotection function; a second layer formed on the first layer to protectthe first layer from exposure to air; and a third layer of a powderformed on the second layer for discharge stabilization, the third layerbeing exposed to the discharge space, wherein the first, second, andthird layers are formed in a vacuum manufacturing process, wherein, uponthe vacuum manufacturing process, the powder of the third layer has alayer of a material having a low reactive property with respect tocomponents of air that is formed so as to cover a powder core of thethird layer, the powder core containing at least one crystal powderselected from CaO, and SrO, and wherein at least a part of the secondlayer and at least a part of the low reactive layer are removed by anaging discharge such that portions of the first layer, the second layer,the third layer and the powder core are exposed to the discharge space.2. The plasma display panel according to claim 1, wherein a material ofthe first layer is a metal oxide containing at least one selected fromCaO, BeO, SrO, and BaO.
 3. The plasma display panel according to claim1, wherein the second layer is an MgO layer having a thickness of 0.1 μmformed by vapor deposition.
 4. The plasma display panel according toclaim 1, wherein the low reactive layer contains at least one selectedfrom Mg, Si, Al, Ti, Y, Zr, Ta, Zn, Co, Mn, and La.
 5. A method ofmanufacturing a plasma display panel comprising, as steps of forming astructure of a plate structure on a side exposed to a discharge space towhich a discharge gas is filled, the steps of: in a vacuum manufacturingprocess: forming a first layer having a discharge protection function ona dielectric layer; forming a second layer on the first layer forprotecting the first layer from exposure to air; forming a third layerof a powder on the second layer for discharge stabilization such thatthe third layer is exposed to the discharge space; and after said vacuummanufacturing process, removing at least a part of the second layer inthe discharge space by an aging discharge process to form a structure inwhich at least a part of a surface of the first layer is exposed to thedischarge space from a part where the second layer is removed, whereinthe powder of the third layer has a structure having a powder core and alayer of a material having a low reactive property to air covering asurface of the powder core, wherein the powder core includes at leastone crystal powder selected from CaO and SrO, and wherein, by the agingdischarge process, at least a part of the low reactive layer is removedso as to expose a portion of the powder core to the discharge space. 6.The method of manufacturing a plasma display panel according to claim 5,wherein the second layer is an MgO layer having a thickness of 0.1 μmformed by vapor deposition.